Manual Probe systems

MPI TS150 is an open, easy to use and cost effective manual probe system designed for precision analysis of substrates and wafers up to 150mm.

MPI High-Power device characterization systems are specifically designed for on-wafer high power device testing. MPI TS150-HP probe systems provide a complete 150 mm on-wafer solution. They are engineered to achieve low contact resistance measurements of power semiconductor under wide range of temperatures.

MPI High-Power device characterization systems are specifically designed for on-wafer high power device testing. TS200-HP probe systems provide a complete 150 mm and 200 mm on-wafer solution. They are engineered to achieve low contact resistance measurements of power semiconductor under wide range of temperatures.

MPI  TS150 manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 150mm.

They may be configured to support a wide variety of applications such as  Failure Analysis ,  Design Validation/IC Engineering ,  Wafer Level Reliability ,  High Power ,  Device Characterization ,  MEMS  and  Signal Integrity  as well.

MPI TS200 manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 200mm.

They may be configured to support a wide variety of applications such as  Failure Analysis ,  Design Validation/IC Engineering ,  Wafer Level Reliability ,  High Power ,  Device Characterization ,  MEMS  and  Signal Integrity  as well.

MPI  TS300 manual probe systems are open, easy to use and cost effective yet highly accurate. These systems are designed for precision analysis of substrates and wafers up to 300mm.

They may be configured to support a wide variety of applications such as  Failure Analysis ,  Design Validation/IC Engineering ,  Wafer Level Reliability ,  High Power ,  Device Characterization ,  MEMS  and  Signal Integrity  as well.

MPI TS150–THZ engineering probe system is a dedicated, cost effective, manual probe system designed especially for precision analysis of substrates and 150 mm wafers in sub THz range.  The system is extremely stable, with a large probe platen, and a low-profile design. Each of these essential elements are required to support a wide variety of RF and mmW applications such as broadband up to 220 GHz, banded solutions up to 1.1THz, load-pull and RF noise. 

MPI TS200–THZ probe system expand MPI one-of-a-kind system solutions for emerging THz applications by adding active impedance tuner integrations on the same probe stations. It’s the industry’s first explicitly designed 150 mm and 200 mm probe systems providing accurate tests for the combination of requirements for mm-wave, THz, and automated impedance tuner applications with best possible measurement directivity.

The MPI TS200-ShielDEnvironment™ (TS200-SE) is designed to ensure advanced EMI/RFI/light-tight shielding, ultra-low noise, low leakage measurement capabilities in a temperature range from -60 to +300°C.

The MPI TS300-ShielDEnvironment™ (TS300-SE) is designed to ensure advanced EMI/RFI/light-tight shielding, ultra-low noise, low leakage measurement capabilities on 300 mm wafer in a temperature range from -60 to +300°C.

In addition, it can be configured with light curtain safety system as TS300-HP for dedicated  High-Power  measurements up to 10 kV / 600 A or with MPI IceFreeEnvironment™ to become a probe station for  Design Validation (Product Engineering)  supporting long customized probe card up 15” length and probing with MicroPositioners (active impedance probes) simultaneously.

It’s incorporated with vibration isolation table at optimal height to make the daily operation very convenient.

The TS300-PCB is our most adaptable manual probe station, designed for testing on wafers up to 300mm and large PCB boards up to 610x500mm. Ideal for RF, mmW , Signal Integrity measurements, Failure Analysis , and Design Validation applications, the TS300-PCB features an air-bearing stage, Probe Hover Control™, and a dedicated probe platen with large microscope movement for extensive probing coverage.

The TS300-PCB is our most adaptable manual probe station, designed for testing on wafers up to 300mm and large PCB boards up to 610x500mm. Ideal for RF, mmW , Signal Integrity measurements, Failure Analysis , and Design Validation applications, the TS300-PCB features an air-bearing stage, Probe Hover Control™, and a dedicated probe platen with large microscope movement for extensive probing coverage.