TS300-SE
MPI
TS300-SE
300mm Shielded Manual System
Price on Request
Product specifications
| SKU | MPI-TS300-SE |
|---|---|
| Manufacturer | MPI |
Documentation
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Description
The MPI TS300-ShielDEnvironment™ (TS300-SE) is designed to ensure advanced EMI/RFI/light-tight shielding, ultra-low noise, low leakage measurement capabilities on 300 mm wafer in a temperature range from -60 to +300°C.
In addition, it can be configured with light curtain safety system as TS300-HP for dedicated High-Power measurements up to 10 kV / 600 A or with MPI IceFreeEnvironment™ to become a probe station for Design Validation (Product Engineering) supporting long customized probe card up 15” length and probing with MicroPositioners (active impedance probes) simultaneously.
It’s incorporated with vibration isolation table at optimal height to make the daily operation very convenient.
Key benefits
Microscope Mount and Movement
- Stable bridge for high quality optics
- Linear z lift for easy reconfiguration
- 50 x 50 mm linear XY movement
DC and RF MicroPositioners
- Supports up to 4 RF and 8 DC MicroPositioners
- Wide range of MicroPositioners available
- Dedicated probe arms for DC/CV and RF measurements
RF Calibration
- 2 auxiliary chucks for calibration substrates
- Built-in ceramic for accurate calibration
- 1 μm flatness for consistent contact quality
Probe Platen
- Stable and rigid design
- Rectangular adjustments for RF MicroPositioners
- Integrated probe platen air-cooling for max. thermal stability
Unique Platen Lift
- Three discrete positions for contact, separation (300 μm) and safety loading 3 mm
- Safety lock function at loading position
- Probe Hover Control (PHC™) with 50, 100 or 150 μm hover height for easy and continent probe to pad alignment
- “Auto Contact“ position with ±1 μm repeatability for consistent contact quality
ShielDEnvironment™
- Excellent EMI and light-tight shielded test environment for ultra-low noise, low capacitance measurements
- Front door for manual loading of IC or wafers ShielDCap™
- Consequent shielding and easy re-configuration
- Allows up to 4-port RF or up to 8-ports DC/Kelvin or a combination of those configurations
- 4.5” probe card adapter optional available
- Automated frontdoor on/off lock function for safety icefree testing
Microscope and Optics Options
- Various optics options available
- iMAG® M or single tube MPI SZ10, MZ12 with up to 12x zoom and 95 mm working distance
- HDMI cameras, monitor user interface without computer
Thermal Chuck Integration
- Full thermal chuck control over touchscreen display
- Easy operation and temperature feedback
Modular Chucks
- Various non-thermal or MPI & ERS PRIME thermal chucks
- Choice of Triaxial or Coaxial connection
- Wide range of temperature from -60°C and up to 300°C
- Field upgradable for reduced cost of ownership
- Easy switch between center and small wafer size control
Kelvin Interface
- Optional Kelvin interface for easy cable management
Chuck XYZ Stage Movement
- Unique puck controlled air bearing stage for quick single-handed operation
- 225 x 260 mm XY fast and fine stage movement
- Resolution < 1.0 μm (0.04 mils) @ 500 μm/rev
- 20 mm Z load / unload stroke, pneumatically
- 5 mm fine Z, resolution < 1.0 μm (0.04 mils) @ 500 μm/rev
- ±5° Theta fine adjustment
- Extra wide Y-range for easy wafer loading
Front Mounted Vacuum Control
- Easy access
- Clearly marked
Integrated Vibration Isolation Table
- Designed for optimized footprint
- Low profile design for maximum usability