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TS200-HP

MPI

TS200-HP

200mm Manual High Power System

Price on Request

Product specifications

SKU MPI-TS200-HP
Manufacturer MPI

Documentation

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Description

MPI High-Power device characterization systems are specifically designed for on-wafer high power device testing. TS200-HP probe systems provide a complete 150 mm and 200 mm on-wafer solution. They are engineered to achieve low contact resistance measurements of power semiconductor under wide range of temperatures.

Key benefits

Light Curtain

  • Interlock-enabled safety light curtain protects users from accidental high voltage shock
  • Interface panel for Keysight B1505A & Keithley instrumentation

Anti-Arcing Technologies

  • ArcShieldTM to prevent arcing between chuck and probe platen
  • LiquidTrayTM to safely place the wafer for high voltage test in arcing suppressing liquid

MicroPositioners

  • Supports up to 4 high current and 8 high voltage positioners
  • Various positioners available
  • Dedicated Coax and Triax high voltage and high current probe arms

Probe Platen

  • Fine adjustment of platen height up to 20 mm, with 1 mm scale
  • Supports DC/CV, RF and High Power measurements
  • Rectangular adjustments for RF MicroPositioners
  • Integrated probe platen air-cooling for maximum thermal stability

Unique Platen Lift

  • Three discrete positions for contact, 300 μm separation and 3 mm safety loading
  • Safety lock function at loading position
  • “Auto Contact“ position with 1 μm repeatability
  • Additional stop at 50, 100 or 150 μm alignment height

ShielDEnvironment™

  • Advanced EMI and light-tight shielded test environment for ultra-low noise, low capacitance measurements
  • Front door for manual loading of IC or wafers ShielDCap™
  • Automated front door lock function for safe ice-free testing

Front Mounted Vacuum Control

  • Easy access and clearly marked
  • Integrated active vibration isolation table

High Power Probes

  • High voltage, low leakage probes up to 10 kV
  • High current, multi-fingers probes up to 200 A (pulse)
  • Ultra high power, multi-fingers probes up to 10 kV/600 A (pulse)

Microscope Mount and Movement

  • Stable bridge for high quality optics
  • 50 x 50 mm linear XY movement
  • Linear z lift for easy reconfiguration

Microscope and Optics

  • Single tube MPI SZ12, MZ12
  • Up to 12x zoom and 101 mm working distance
  • HDMI cameras, monitor user interface without computer

Modular Chucks

  • Various High Power non-thermal or thermal chucks
  • Wide range of temperature from -60 °C up to 300 °C
  • Field upgradable for reduced cost of ownership
  • Thin wafer handling capability
  • 10 kV (Coax), 3kV (Triax)
  • Gold plated for low contact resistance
  • MPI 10kV chuck connectors for safe instrument connection
  • Re-use chuck cooling air for chamber purge

Chuck XYZ Stage Movement

  • Unique puck-controlled air bearing stage for chuck singlehanded operation
  • 225 x 260 mm XY total stage movement
  • 25 x 25 mm XY fine micrometer adjustment
  • Resolution < 1.0 μm (0.04 mils) @ 500 μm/rev
  • Chuck theta rotation of 360° with +/-5° fine travel
  • Safe contact function locks the XY stage while in contact
  • 20 mm pneumatically Z load stroke,
  • 5 mm fine Z, resolution < 1.0 μm @ 500 μm/rev
  • Extra wide Y-range for easy wafer loading
  • Optional independent lock of the X or Y axis

Safety Test ManagementTM (STM) System

  • Provides unique safety, reliable and convenient environment for testing at different temperatures
  • Intelligent dew point control routine avoids acumination during cold testing
  • Automatically monitoring the flow of CDA or Nitrogen
  • If the flow is interrupt or insufficient the STMTM turns the chuck automatically into safe mode

Anti-arcing probe card

  • High pressure application for testing up to 10 kV/600A
  • Temperature testing up to 150 °C