Toggle Nav

TS3500-HP

TS3500-HP

Advanced 300 mm High Power Solutions

Price on Request

Product specifications

SKU MPI-TS3500-HP
Brand MPI

Documentation

Please use the icons below to download any files related to this item. We aim to have the datasheet and/or catalog available.

Description

The TS3500-HP is MPI’s new, dedicated probe station for on-wafer High-Power device characterization over a wide -60°C to +300°C temperature range and wide 3 kV (triax) / 10 kV (coax) and 600 A measurement range. Testing on thin or Taiko wafers is an option available.

It incorporate MPI’s ShielDEnvironment™ for ultra-low noise measurements and with the WaferWallet®, TS3500-HP is the ideal choice for increased demands in productivity (up to 10x higher) and handling fully-automatic wafer-handling e.g., 150 mm SiC, 200 mm GAN, as well as 300 mm SiGe wafers.

Key benefits

Light Curtain

  • Interlock-enabled safety light curtain protects users from accidental high voltage shock

MicroPositioners

  • Supports up to 4 RF and 8 DC MicroPositioners
  • Wide range of MicroPositioners available, including programmable and large area for mmW applications
  • Dedicated Coax, Triax and Kelvin probe arms
  • 4.5” probe card holder: standard or dedicated for long term measurements

Probe Platen

  • Stable and rigid design, with active platen cooling for high temperature tests
  • Rectangular adjustments for RF positioners
  • Integrated air-cooling for maximum thermal stability
  • Supports up to 4 RF or up to 8 DC MicroPositioners

Probe Hover Control PHC™

  • Manual control of probes to wafer contact & separation
  • Visual feedback down to 1 μm accuracy in SENTIO®

Modular Chucks

  • Various High Power non-thermal or thermal chucks
  • Field upgradable for reduced cost of ownership
  • MPI’s proprietary triaxial connector for ultra-low noise 3kV triaxial and 10kV coaxial set-ups without any changes to the chuck connection

MPI WaferWallet® Option

  • Designed with five individual trays for manual, ergonomic loading of 150, 200, or 300 mm “modeling” wafers
  • Fully-automated tests with up to five identical wafers at multiple temperatures
  • Unique capability to load/unload wafers at any temperature

Active Vibration Isolation

  • Incorporates a high performance vibration isolation platform
  • Optimized total footprint
  • Optional instrument shelf reduces cable lengths and increases measurement dynamic and directivity

High-Voltage, High-Current & Ultra High-Power Probes

  • High Voltage (3kV TRX, 5kV or 10kV COAX) , High Current (up to 100A) and Ultra-High-Power probes (up to 10kV / 600A)

mDrive™ Option

  • Provides a truly intuitive, manual operation of all existing programmable stages, such as chuck, scope or MicroPositioners
  • X- and Y-axis fine control for the selected stage
  • Z safety function requires additional enabling

Microscope and Optics Options

  • Stable microscope bridge mount with 50 x 50 x 140 mm programmable movement
  • Various optics options available such as MPI AMZ12 w. up to 12x optical zoom or MPI iMAG® - the digital microscope

Software Suite SENTIO®

  • Revolutionary multi-touch, single window GUI for easy and intuitive system operation
  • Scroll, zoom, move commands mimic modern smart mobile devices making everyone the operation expert just in minutes
  • Switching between applications is just a matter of a finger swipe
  • Integrated workflow with MPI RF calibration software QAlibria® provides unparalleled user experience
  • GPIB, TCP/IP interface for remote control

Anti-Arcing Technologies

  • ArcShield™ to prevent any possible arcing between the chuck and the probe platen
  • The anti-arcing probe card has a capability to apply high-pressure around the DUT and by using the Paschen law to prevent arcing between the pads
  • Anti-Arcing LiquidTray™ can be used for arcing suppressing by simply placing it on the high power chuck surface. Wafers can be safely placed inside the tray to submerge in the liquid for arcing free high voltage test

Integrated Hardware Control Panel

  • Provide faster, safer and more convenient system operation and control
  • Keyboard and the mouse are at the system control panel for a singlepoint operation with the system and controlling test instrumentation

MPI ShielDEnvironment™

  • The mosts advanced EMI / RFI / Light-tight shielding on the market
  • fA, fF low-level measurement

MPI & ERS PRIME Thermal Chucks

  • ERS and MPI’s joint product AirCool® PRIME Chuck won “Electronics Industry Awards 2018” in the category, “Test, Measurement and Inspection Product of the year”
  • Wide temperature range -60 °C to 300 °C with unique 1.1, 3kV and 10kV configuration capabilities, Taiko-wafer option
  • Convenient location of the control panel for fast and easy interaction with the system
  • Reduced footprint by smart integration of the chiller space

Vertical Contact Environment VCE™ Option

  • Automated side view of the probe tips – the VCE™ allows contact position automation independent of the probe card tip-drop
  • This enables working with probe cards, either DC or RF, very safe, especially inside the MPI ShielDEnvironment™